REGISTER  |  SIGN IN
United States Patent6449574
Eryurek , ; et al.September 10, 2002
Title
Resistance based process control device diagnostics
Abstract
A device in a process control system includes an electrical element which has a resistance. Self heating circuitry coupled to the element provides a self heating signal related to the resistance of the element. Diagnostic circuitry provides a diagnostic output as a function of the self heating signal output.
Inventors:Eryurek; Evren (Minneapolis, MN), Warrior; Jogesh  (Mountain View, CA), Patten; Andrew T.  (Louisville, CO)
Assignee:Micro Motion, Inc. (Boulder, CO)
Rosemount Inc. (Eden Prairie, MN)
Appl. No.:09/616,118
Filed:July 14, 2000
Current U.S. Class:702/99 374/1 374/172 702/130 
Field of Search:702/99,130,133,136 374/1,172
U.S. Patent Documents
3096434July 1963King
3404264October 1968Kugler
3468164September 1969Sutherland
3590370June 1971Fleischer
3688190August 1972Blum
3691842September 1972Akeley
3701280October 1972Stroman
3973184August 1976Raber
4058975November 1977Gilbert et al.
4099413July 1978Ohte et al.
4102199July 1978Talpouras
4122719October 1978Carlson et al.
4249164February 1981Tivy
4250490February 1981Dahlke
4337516June 1982Murphy et al.
4399824August 1983Davidson
4517468May 1985Kemper et al.
4530234July 1985Cullick et al.
4635214January 1987Kasai et al.
4642782February 1987Kemper et al.
4644479February 1987Kemper et al.
4649515March 1987Thompson et al.
4707796November 1987Calabro et al.
4736367April 1988Wroblewski et al.
4777585October 1988Kokawa et al.
4831564May 1989Suga
4841286June 1989Kummer
4873655October 1989Kondraske
4907167March 1990Skeirik
4924418May 1990Backman et al.
4934196June 1990Romano
4939753July 1990Olson
4964125October 1990Kim
4988990January 1991Warrior
4992965February 1991Holter et al.
5005142April 1991Lipchak et al.
5043862August 1991Takahashi et al.
5053815October 1991Wendell
5067099November 1991McCown et al.
5081598January 1992Bellows et al.
5089984February 1992Struger et al.
5098197March 1992Shepard et al.
5099436March 1992McCown et al.
5103409April 1992Shimizu et al.
5111531May 1992Grayson et al.
5121467June 1992Skeirik
5122794June 1992Warrior
5122976June 1992Bellows et al.
5130936July 1992Sheppard et al.
5134574July 1992Beaverstock et al.
5137370August 1992McCullock et al.
5142612August 1992Skeirik
5143452September 1992Maxedon et al.
5148378September 1992Shibayama et al.
5167009November 1992Skeirik
5175678December 1992Frerichs et al.
5193143March 1993Kaemmerer et al.
5197114March 1993Skeirik
5197328March 1993Fitzgerald
5212765May 1993Skeirik
5214582May 1993Gray
5224203June 1993Skeirik
5228780July 1993Shepard et al.
5235527August 1993Ogawa et al.
5265031November 1993Malczewski
5265222November 1993Nishiya et al.
5269311December 1993Kirchner et al.
5274572December 1993O'Neill et al.
5282131January 1994Rudd et al.
5282261January 1994Skeirik
5293585March 1994Morita
5303181April 1994Stockton
5305230April 1994Matsumoto et al.
5311421May 1994Nomura et al.
5317520May 1994Castle
5327357July 1994Feinstein et al.
5333240July 1994Matsumoto et al.
5349541September 1994Alexandro, Jr. et al.
5357449October 1994Oh
5361628November 1994Marko et al.
5365423November 1994Chand
5367612November 1994Bozich et al.
5384699January 1995Levy et al.
5386373January 1995Keeler et al.
5394341February 1995Kepner
5394543February 1995Hill et al.
5404064April 1995Mermelstein et al.
5408406April 1995Mathur et al.
5408586April 1995Skeirik
5414645May 1995Hirano
5419197May 1995Ogi et al.
5430642July 1995Nakajima et al.
5440478August 1995Fisher et al.
5442639August 1995Crowder et al.
5467355November 1995Umeda et al.
5469070November 1995Koluvek
5469156November 1995Kogura
5469735November 1995Watanabe
5469749November 1995Shimada et al.
5481199January 1996Anderson et al.
5483387January 1996Bauhahn et al.
5485753January 1996Burns et al.
5486996January 1996Samad et al.
5488697January 1996Kaemmerer et al.
5489831February 1996Harris
5495769March 1996Broden et al.
5510779April 1996Maltby et al.
5511004April 1996Dubost et al.
5548528August 1996Keeler et al.
5561599October 1996Lu
5570300October 1996Henry et al.
5572420November 1996Lu
5573032November 1996Lenz et al.
5598521January 1997Kilgore et al.
5600148February 1997Cole et al.
5623605April 1997Keshav et al.
5640491June 1997Bhat et al.
5661668August 1997Yemini et al.
5665899September 1997Willcox
5669713September 1997Schwartz et al.
5671335September 1997Davis et al.
5675504October 1997Serodes et al.
5675724October 1997Beal et al.
5700090December 1997Eryurek
5703575December 1997Kirkpatrick
5704011December 1997Hansen et al.
5705978January 1998Frick et al.
5708585January 1998Kushion
5713668February 1998Lunghofer et al.
5719378February 1998Jackson, Jr. et al.
5741074April 1998Wang et al.
5742845April 1998Wagner
5746511May 1998Eryurek et al.
5752008May 1998Bowling
5764891June 1998Warrior
5781878July 1998Mizoguchi et al.
5801689September 1998Huntsman
5805442September 1998Crater et al.
5828567October 1998Eryurek et al.
5829876November 1998Schwartz et al.
5848383December 1998Yunus
5859964January 1999Wang et al.
5876122March 1999Eryurek
5887978March 1999Lunghofer et al.
5923557July 1999Eidson
5924086July 1999Mathur et al.
5926778July 1999Poppel
5940290August 1999Dixon
5956663September 1999Eryurek
5970430October 1999Burns et al.
6016706January 2000Yamamoto et al.
6017143January 2000Eryurek et al.
6045260April 2000Schwartz et al.
6047220April 2000Eryurek et al.
6047222April 2000Burns et al.
6119047September 2000Eryurek et al.
6192281February 2001Brown et al.
6195591February 2001Nixon et al.
6199018March 2001Quist et al.
6263487July 2001Stripf et al.
RE29383September 1977Gallatin et al.
Foreign Patent Documents
0 122 622Oct., 1984EP
0 413 814Feb., 1991EP
0 487 419May., 1992EP
0 594 227Apr., 1994EP
0 624 847Nov., 1994EP
0 644 470Mar., 1995EP
0 807 804Nov., 1997EP
0 825 506Jul., 1997EP
0 827 096Sep., 1997EP
0 838 768Sep., 1997EP
06242192Sep., 1994JP
07234988Sep., 1995JP
1 534 280Nov., 1978GB
10-232170Sep., 1998JP
1058093May., 1999EP
195 02 499Aug., 1996DE
197 04 694Aug., 1997DE
19930660Jul., 1999DE
2 302 514Sep., 1976FR
2 310 346Aug., 1997GB
2 334 827Jul., 1977FR
2-5105Jan., 1990JP
2753592Mar., 1998JP
296 00 609Mar., 1997DE
299 17 651Dec., 2000DE
32 13 866Oct., 1983DE
35 40 204Sep., 1986DE
40 08 560Sep., 1990DE
44 33 593Jun., 1995DE
5-122768May., 1993JP
58-129316Aug., 1983JP
59-116811Jul., 1984JP
59-211196Nov., 1984JP
59-211896Nov., 1984JP
60-131495Jul., 1985JP
60-507Jan., 1985JP
60-76619May., 1985JP
62-30915Feb., 1987JP
64-1914Jan., 1989JP
64-72699Mar., 1989JP
7-63586Mar., 1995JP
8-136386May., 1996JP
8-166309Jun., 1996JP
8-54923Feb., 1996JP
928704Jun., 1963GB
WO 00/70531Nov., 2000WO
WO 94/25933Nov., 1994WO
WO 96/11389Apr., 1996WO
WO 96/12993May., 1996WO
WO 96/39617Dec., 1996WO
WO 97/21157Jun., 1997WO
WO 97/25603Jul., 1997WO
WO 98/06024Feb., 1998WO
WO 98/20469May., 1998WO
Other References
Wang Lei et al., "Improving Dynamic Performance of Temperature Sensors with Fuzzy Control Technique", IEEE, 1992.
Primary Examiner: Assouad; Patrick
Attorney, Agent or Firm:Champlin; Judson K. Westman, Champlin & Kelly
Parent Case Text


This is a continuation of U.S. application Ser. No. 09/138,446, filed Aug. 21, 1998, now abandoned, which is a Continuation-In-Part application of U.S. Ser. No. 09/016,216, filed Jan. 30, 1998 now abandoned which is a Continuation-In-Part application of U.S. Ser. No. 08/744,980, filed on Nov. 7, 1996, now U.S. Pat. No. 5,828,567.
Claims

What is claimed is:
1. A process control device in a process control system, comprising: an electrical element having an electrical resistance; process control device circuitry coupled to the electrical element to perform a process control function; self heating circuitry coupled to the electrical element providing a self heating signal related to a self heating index (SHI) representing an amount of degradation of the electrical element due to the electrical resistance; circuitry coupled to a process control loop for coupling the device to the loop; and diagnostic circuitry coupled to the self heating circuitry responsively providing a diagnostic output related to health of the electrical element as a function of the self heating signal.

2. The device of claim 1 including a memory storing at least one expected result related to the self heating signal.

3. The device of claim 1 wherein the diagnostic circuitry comprises a neural network.

4. The device of claim 1 wherein the diagnostic circuitry comprises fuzzy logic.

5. The device of claim 1 wherein the diagnostic circuitry comprises regression models.

6. The device of claim 1 wherein the diagnostic output is related to a residual lifetime estimate for the electrical element.

7. The device of claim 6 wherein the diagnostic circuitry determines the residual lifetime estimate as a function of rate of change (ROC) of the self heating signal.

8. The device of claim 1 wherein the self heating circuitry includes a current source and voltage measurement circuitry.

9. The device of claim 1 wherein the self heating circuitry determines a self heating index (SHI) as a function of change in resistance of the electrical element in response to a change in power applied to the electrical element.

10. The device of claim 8 wherein the self heating index (SHI) is calculated as (R.sub.1 -R.sub.2)/(P.sub.1 -P.sub.2).

11. The device of claim 1 wherein the output circuitry calibrates the electrical element as a function of the self heating signal.

12. The device of claim 1 wherein the electrical element comprises a strain gauge.

13. The device of claim 1 wherein the electrical element comprises a control element.

14. The device of claim 1 wherein the electrical element comprises a sense element.

15. The device of claim 1 wherein the electrical element comprises a thermocouple.

16. The device of claim 1 wherein the electrical element comprises a coil.

17. The device of claim 16 wherein the coil comprises a sensor in a coriolis flowmeter.

18. The device of claim 16 wherein the coil comprises a driver of a coriolis flowmeter.

19. A method for diagnosing an electrical element in a process control device, comprising: obtaining a self heating index (SHI) representing an amount of degradation for an electrical element of the device, the electrical element having a resistance; and providing an electrical element diagnostic output as a function of the SHI.

20. The method of claim 19 wherein obtaining the SHI comprises measuring change in resistance of the electrical element in response to a change in power applied to the electrical element.

21. The method of claim 20 wherein the self heating index is calculated as (R.sub.1 -R.sub.2)/(P.sub.1 -P.sub.2).

22. The method of claim 19 including estimating residual life of the electrical element based upon a rate of change of the SHI.

23. The method of claim 22 wherein obtaining the SHI includes sequentially injecting at least two different current levels into the electrical element and measuring the resultant voltage drops across the electrical element.

24. The method of claim 19 including determining life expectancy of the electrical element as a function of the diagnostic output.

25. The method of claim 19 including calibrating the electrical element as a function of the SHI.

26. A device for use in a process control system, comprising: I/O circuitry adapted to coupled to a process control loop; an electrical element having a resistance; a current source coupled to the electrical element to inject a current into the electrical element; voltage measurement circuitry coupled to the electrical element providing an output related to voltage drop across the electrical element; and diagnostic circuitry providing a self heating index (SHI) output representing an amount of degradation of the electrical element as a function of injected current and the voltage drop across the electrical element due to the resistance.

27. The device of claim 26 wherein the diagnostic circuitry provides a life expectancy output of the electrical element as a function of the SH index.

28. The device of claim 26 including measurement circuitry providing an output related to a process variable as a function of an output from the electrical element and the SH index.

29. The device of claim 26 wherein the SH index is determined as a function of a change in resistance of the electrical element in response to a change in power applied to the electrical element.

30. The device of claim 26 wherein the SH index is calculated as (R.sub.1 -R.sub.2) (P.sub.1 -P.sub.2).

31. The device of claim 26 wherein the electrical element comprises a strain gauge.

32. The device of claim 26 wherein the electrical element comprises a control element.

33. The device of claim 26 wherein the electrical element comprises a sense element.

34. The device of claim 26 wherein the electrical element comprises a coil.

35. The device of claim 26 wherein the electrical element comprises a thermocouple.

36. A process control device in a process control system, comprising: an electrical element having an electrical resistance; process control device circuitry coupled to the electrical element to perform a process control function; self heating circuitry coupled to the electrical element providing a self heating signal related to a self heating index (SHI) representing an amount of degradation of the electrical element due to the electrical resistance, the SHI defined as a change in resistance of an electrical element for a given change in power input to the element; circuitry coupled to a process control loop for coupling the device to the loop; and diagnostic circuitry coupled to the self heating circuitry responsively providing a diagnostic output related to health of the electrical element as a function of the self heating signal.

37. A method for diagnosing an electrical element in a process control device, comprising: obtaining a self heating index (SHI) representing an amount of degradation for an electrical element of the device, the electrical element having a resistance, the SHI defined as a change in resistance of an electrical element for a given change in power input to the element; and providing an electrical element diagnostic output as a function of the SHI.

38. A device for use in a process control system, comprising: I/O circuitry adapted to couple to a process control loop; an electrical element having a resistance; a current source coupled to the electrical element to inject a current into the electrical element; voltage measurement circuitry coupled to the electrical element providing an output related to voltage drop across the electrical element; and diagnostic circuitry providing a self heating index (SHI) output representing an amount of degradation of the electrical element as a function of injected current and the voltage drop across the electrical element due to the resistance, the SHI defined as a change in resistance of an electrical element for a given change in power input to the element.
Description
BACKGROUND OF THE INVENTION

The present invention relates to equipment of the type used in the process control industry. More specifically, the invention relates to diagnostics for process control device in which the diagnostics is a function of a resistance.

Process control devices are used to monitor process variables and control industrial processes. For example, a process control transmitter might monitor temperature and transmit such information back to a control room. Furthermore, a process controller such as a valve controller is used to control the process.

As sensors, control elements or other components are subjected to harsh environmental conditions, the accuracy of the system tends to degrade. It is possible to compensate for this degradation by periodically recalibrating the device. Typically, this requires an operator to enter the field and perform a calibration process on-site on the device. This is both inconvenient and time consuming for the operator. Further, it is difficult to determine the condition of a device, prior to its ultimate failure.

It is also necessary for the device or their components to be periodically replaced as they age. However, it is difficult to determine precisely when such replacement is necessary. Therefore, components are typically replaced well before their failure or, in some cases, they may fail unexpectedly requiring an unscheduled system shutdown.

SUMMARY OF THE INVENTION

A device in a process control system includes an electrical element which has a resistance. Self heating circuitry coupled to the element provides a self heating signal related to the resistance of the electrical element. Diagnostic circuitry provides an output as a function of the self heating signal output, for example, a residual life estimate of the element or a calibration output.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows a process control system including a transmitter in accordance with the present invention.

FIG. 2 is a block diagram of a transmitter of the present invention.

FIG. 3 is a simplified flow chart of a transmitter in accordance with one embodiment of the invention.

FIG. 4 is a simplified schematic in accordance with an embodiment of the present invention.

FIG. 5 is a simplified block diagram of a process control device in accordance with the invention.

FIG. 6 is a simplified diagram of a coriolis flowmeter in accordance with one embodiment of the invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

FIG. 1 is a diagram of process control system 2 including field mounted temperature transmitter 40 and a valve controller 12 coupled electrically to control room 4 over a two wire process control loops 6 and 14, respectively. Transmitter 40, mounted on a manifold and connected to the pipe via a manifold, monitors the process variable of process fluid in process piping 18. The present invention applies to any electrical element in a process control device. Examples of process variable sensors which include a resistance includes sensors for pressure, flow, pH, turbidity, level, etc. In one embodiment, transmitter 40 is a temperature transmitter which transmits temperature information to control room 4 over loop 6 by controlling the current flowing through loop 6. For example, the current flowing through loop 6 may be controlled between 4 and 20 mA and properly calibrated to indicate temperature. Additionally or in the alternative, transmitters in accordance with the invention may transmit digital information related to temperature over loop 6 to control room 4 such as in a HART.RTM. or an all digital protocol such as Fieldbus. Transmitter 40 includes circuitry described herein in more detail which provides advanced diagnostics related to sensor operation.

One aspect of the present invention includes a recognition of a close correlation, in some cases linear relationship, of the self heating (SH) index to the "alpha" of an RTD sensor. As is known, the alpha of a sensor is related to sensor calibration and therefore to sensor lifetime. Accordingly, if the SH index is measured, the lifetime of the sensor can be estimated. Furthermore, the sensor output can be corrected in real-time as a function of the amount of degradation (e.g., the difference between a preselected value of the SH index and the true current value of the SH index). This provides an autocorrection to the transmitter output.

One aspect of the invention includes a new technique for determining the SH index of a resistive element in a transmitter. Typically, prior art self heating index measurement was performed by monitoring temperature change in the element due to an applied current. However, in a process control device it is impractical to perform such a measurement due to power limitations and the necessity of a separate temperature measurement. The present invention includes defining the self heating index as the change in resistance of an electrical element for a given change in the power input to the element. This technique is preferable for a process control device because it does not require the resistive element to be calibrated to temperature. Furthermore, the technique does not require the element to be removed from the process such that real-time data can be collected without the trouble and cost of interrupting the process. The self heating index can be calculated in a process control device by applying two different input currents, for example, 5 mA and 15 mA to the electrical element. The resulting voltages across the resistance are measured and the resistance of the element is calculated at the two different currents using, for example, the equation R=V/I. The power applied to the element is determined at the two different currents as P=I.multidot.V. The self heating index is calculated in accordance with equation 1: ##EQU1##

The invention can be practiced in any of a number of places in a process system control system. In particular, the present invention as realized in software and a microprocessor, can reside in a central controller or a final control element such as a valve, motor or switch. Furthermore, modern digital protocols such as Fieldbus, Profibus and others allow for the software which practices the present invention to be communicated between elements in a process control system, and also provide for process variables to be sensed in one transmitter and then sent to the software.

FIG. 2 is a simplified block diagram of the invention implemented in a temperature transmitter 40 connected to RTD temperature sensor 10. Transmitter 40 includes terminal block 44, current source 45, multiplexer 46, differential amplifier 48, high accuracy A/D converter 50, microprocessor 52, clock circuit 54, memory 56 and input-output circuit 58.

Terminal block 44 includes terminals 1 through 4 for coupling to, for example, RTD temperature sensor 10. Sensor 10 can be either internal or external to transmitter 40. Sensor 10 includes RTD sensor element 61 having a resistance R.sub.1 which varies with changes in the ambient temperature. Leads 16 include four element leads 62, 64, 66 and 68. Lead 62 is connected between sensor element 61 and terminal 4, lead 64 is connected between sensor element 61 and terminal 3, lead 66 is connected between sensor element 61 and terminal 2, and lead 68 is connected between sensor element 61 and terminal 1.

Current source 45 is connected to terminal block 44 and supplies a measurement current I.sub.S through terminal 4, sensor element 61, terminal 1, reference resistance R.sub.REF, pull-down resistance R.sub.2 and ground terminal 72. Sensor element
61 develops a voltage drop across terminals 2 and 3 which is a function of the resistance R.sub.1 and thus the temperature of sensor element 61. Reference resistor R.sub.REF is connected between terminal 1 and pull-down resistor R.sub.2.

Multiplexer 46 is divided into two sections, an active multiplexer having an output connected to the non-inverting input of differential amplifier 48 and a reference multiplexer having an output connected to the inverting input of differential amplifier 48. Microprocessor 52 controls multiplexer 46 to multiplex appropriate sets of analog signals, including signals from terminals 1 through 3, to the non-inverting and inverting inputs of differential amplifier 48. Differential amplifier 48 has an output connected to A/D converter 50. In one embodiment, A/D converter 50 has an accuracy of 17 bits and a conversion rate of 14 samples/second. A/D converter 50 converts the voltage at the output of differential amplifier 48 into a digital value and provides that value to microprocessor 52 for analysis or for communication over process control loop 6 through input-output circuit 58.

Input-output circuit 58, in a preferred embodiment, includes a HART.RTM. communication section, a FIELDBUS communication section and a 4-20 mA analog loop section for analog or bi-directional digital communicating over loop 6 according to a selected protocol in a known manner. Other protocols can also be used, for example, a four-wire configuration may be employed in which power is received from a separate source. Loop 6 also provides power to the various components of transmitter 40
through input-output circuit 58. Preferably, transmitter 40 is wholly (completely) powered by the two-wire loop 6.

Memory 56 stores instructions and information for microprocessor 52, which operates at a speed determined by clock circuit 60. Clock circuit 60 includes a real time clock and a precision high speed clock, which are also used to sequence the operation of A/D converter 50. Microprocessor 52 performs several functions, including control of multiplexer 46 and A/D converter 50, control of communications over loop 6, temperature compensation, storage of transmitter configuration parameters and performing sensor diagnostics.

Microprocessor 52 employs the following equation to compute the temperature of RTD sensor element 61: ##EQU2##

where: R.sub.1 =resistance of RTD sensor element 61; V.sub.R1 =voltage drop across the RTD sensor element 61; V.sub.RREF =voltage drop across resistance R.sub.REF ; and R.sub.REFNOM =nominal resistance of the reference resistance R.sub.REF in Ohms, and/or stored in memory 56.

Microprocessor 52 measures the voltage drop V.sub.R1 across RTD sensor element 61 between terminals 2 and 3, and the voltage drop (V.sub.RREF) across reference resistance R.sub.REF with multiplexer 46. In a four-wire resistance measurement such as the one shown in FIG. 2, the voltage drop across the connections to terminals 2 and 3 is largely eliminated, since substantially all of the current I.sub.S flows between terminals 1 and 4, and has little impact on the accuracy of the measurement. Microprocessor 52 converts the measured resistance R.sub.1 into temperature units with a look-up table or suitable equations stored in memory 30. For example, one such equation is the Callender-Van Dusen equation which is: ##EQU3##

Where: R(t)=Resistance at temperature t, in Ohms. R.sub.0 =Resistance at temperature 0, Ohm. t=Temperature, deg C. .alpha., .delta., .beta.=Calibration constants. .beta.=0 for t>0 deg C.

However, both stored lookup tables or the equation 2 must be properly calibrated for a particular RTD temperature sensor. Further, such calibration tends to change over time as the alpha (.alpha.) for the sensor drifts. Calibrating an RTD requires an accurate thermometer reference to obtain a number of correct temperature values in order to accurately determine the constants .alpha., R.sub.0 and .delta.. Equation 3 and transmitter calibration are discussed in PRT Handbook Bulletin 1042, dated February 1985, published by Rosemount and incorporated by reference into this application.

The SH index is calculated when microprocessor 52 actuates switch 138 (shown in FIGS. 2 and 4) to couple current source 140 to sensor 61. P.sub.1 and R.sub.1 of the equation on 1 are calculated with current I.sub.SH from source 140 flowing through sensor 61. Microprocessor 52 determines P.sub.2 and R.sub.2 due to current I.sub.S from source 45. The SH index is calculated using equation 1. If transmitter 40 is completely powered from loop 6, the currents I.sub.SH and I.sub.S are limited to the current I in loop 6, less any current required to operate circuitry in transmitter 40.

Microprocessor 52 performs diagnostics related to operation of transmitter 40 using the SH index. The following describes a number of embodiments for realizing the diagnostic circuitry in transmitter 40. Such diagnostics include determining sensor health, performing a residual lifetime estimate may be representative of an impending sensor failure, or performing an autocorrection to the temperature measurement.

Another aspect of the present invention includes the use of the self heating index to correct the temperature measurement to reduce errors due to drift in alpha (.alpha.) and R.sub.0. As the RTD sensor ages, the constant alpha (.alpha.) and R.sub.0 (given in equation 2) for the sensor, changes thereby causing inaccuracies in the temperature measurements. It has been discovered that there is a substantially linear relationship between the SH index and error in the temperature measurement caused by drift in alpha (.alpha.) and R.sub.0. The temperature can be corrected using the equation:

where: T.sub.measured is the measured temperature; K is a constant of proportionality; .DELTA.SHI is the change in the self heating index; and T.sub.corrected is the autocorrected temperature.

FIG. 3 is a block diagram 150 illustrating the present invention as it relates to autocorrection the temperature output as a function of the SH index. Diagram 150 shows operations which would typically be performed by microprocessor 52 in FIG.
2. At block 152, the previous value of the self heating index (SHI.sub.1) is obtained, for example, from memory 56. This value may have been stored in memory during manufacture, previously generated by microprocessor 52 or determined and stored when the transmitter was commissioned or even at a preselected time during operation of transmitter 40. At block 154 the current value of the SH index (SHI.sub.2) is determined by microprocessor 52. If the rate of change, m is greater than or equal to a maximum allowable rate of change (m.sub.MAX), decision block 158 provides an alarm output. In general, a value representative of the difference between SHI.sub.2 and SHI.sub.1 is assessed at block 156. A preferred method for this differencing function is to calculate the slope over time of the two SHI values. However, other methods of assessing the amount of difference, some as simple as comparing SHI.sub.2 to a threshold value, can be implemented without block 156. The output may be transmitted, for example, over loop 6 to indicate that the sensor has degradated to such an extent that failure is imminent and replacement is necessary. Other types of diagnostics may also be performed such as those set forth in the parent application U.S. Ser. No. 08/744,980, filed Nov. 7, 1996 U.S. Pat. No. 5,828,567. The value of m.sub.MAX is stored in memory 56 and may be user configurable based upon the accuracy desired for a particular process. The alarming function at block 158 is optional, but preferred to the present invention.

If the alarm condition does not exist, control passes to decision block 160 in which the measured self heating index (SHI.sub.2) is compared with the stored self heating index (SHI.sub.1). If they are approximately the same, control is passed to block 162 and the temperature is determined. If, on the other hand, there is a difference between the two values, a new value for the .DELTA.SHI in equation 4 is calculated by microprocessor 52 at block 164. Further, other more complex curve fitting techniques can be used to correlate SHI with sensor calibration. Control is passed to block 162 and the new value for .DELTA.SHI in equation 4 is used in determining temperature. The new value for .DELTA.SHI is stored in memory to replace the previous value.

The various functions set forth in FIG. 3 may be performed remotely, in a process control device, in the control room, in a computer located off-site or in a combination of these locations. Generally, the invention can be practiced in any.of a number of places in a process system control system. For example, the present invention as realized in software and a microprocessor, can reside in a central controller or even a final control element such as a valve, motor or switch as shown in FIG. 1. Furthermore, modern digital protocols such as Fieldbus, Profibus and others allow for the software which practices the present invention to be communicated between elements in a process control system, and also provide for process variables to be sensed in one transmitter and then sent to the software.

One embodiment of diagnostic circuitry in the present invention uses empirical models or polynomial curve-fitting which are functions of SH index. For example, a polynomial which is a function of the SH index is used for computing the residual lifetime estimate. The constants and/or the equations may be sent over the two wire loop to transmitter 40. Another diagnostic circuit is implemented with a multi-layer neural network. Although a number of training algorithms can be used to develop a neural network model for different goals, one embodiment includes the known Backpropagation Network (BPN) to develop neural network modules which will capture the nonlinear relationship among a set of input and outputs(s).

Another embodiment of diagnostic circuitry 52 uses a set of if--then rules to reach a conclusion on the status of the temperature sensor RTD 61. The SH index is monitored and its present value is compared to upper and lower boundaries. The upper and lower boundaries are empirically set by testing of many RTD sensors. A decision is made based upon the comparison.

In another aspect of the invention, the rate of change (ROC) of the SH index is correlated with life expectancy of sensor 61. The ROC of the SH index is provided to the diagnostic circuitry implemented in microprocessor 52 which provides an output indicative of expected life, including a warning when the expected remaining sensor life has dropped below a minimum value.

FIG. 5 is a simplified block diagram of a process control device 200 in accordance with more general aspects of the present invention coupled to process control loop 6. Device 200 may be any type of process control device with an electrical element with a measurable resistance. Transmitter 40 of FIG. 1 is one example of instrument 202. Device 200 includes microprocessor 202 coupled to loop 6 through I/O circuitry 204 and to a memory 206. Self heating circuitry 208 couples to a process control element 210 and provides a self heating signal to microprocessor 202. Process control element 210 includes a resistance element 212 having an electrical resistance for which a self heating value is determined by self heating circuitry 208 using the techniques in accordance with the invention. The connection to resistance 212 may be through a four point Kelvin connection to obtain more accurate measurements. A dashed line is shown between element 210 and microprocessor 202. Line 214 is representative of, for example, any connection or exchange of signals between element 210 and microprocessor 202. For example, if element 210 is a process variable sensor, connection 214 provides process variable data to microprocessor 202. Similarly, if element 210 is a control element, connection 214 provides a control input from microprocessor 202 to element 210. One aspect of the invention includes the use of self heating diagnostic techniques to perform diagnostics on any type of process control element. For example, as used herein, a "process control element" includes any element in a process (a transmitter, RTD, strain gauge, pick up or drive coil, etc.) which has a resistance. Process control devices include devices for measuring flowmeters (coriolis, magnetic, vortex, differential pressure, etc.) pressure, level, pH, turbidity temperature, etc. as well as control devices such as valve actuators, solenoids, etc. Some examples of process control elements include RTD 61 described above, as well as electrical coils, wiring which couples to sensors, terminations, terminal blocks, strain gauges or other types of sensors, actuators or other electrical components.

Device 200 may comprise a coriolis flowmeter such as is described in U.S. Pat. No. 5,231,884 issued Aug. 3, 1993 in which process control element 210 is the coil used in a velocity sensor or a driver. For example, FIG. 6 is a simplified block diagram of coriolis flowmeter 230 in accordance with one embodiment of the present invention which includes a flow tube 232 and meter electronics 234. Measurement tubes 236 couple to flow tube 232, a drive coil 240 in a drive element vibrates tubes 236
in response to a drive signal and sense elements which include sense coils 242 and sense magnets 244 provide left and right velocity signals related to the resultant vibration of tubes 236. An RTD temperature sensor 246 provides an RTD signal related to the temperature of tube 236. Diagnostics circuitry of the present invention included in coriolis flowmeter 230 may be used to monitor coils 240 or 242 or RTD sensor 246 and responsively provide a diagnostic output.

Thus, the present invention can detect various types of failures in process device including corrosion of an electrical component. For example, in a wire, termination, coil, RTD, thermocouple, electrical trace on a printed circuit board or other electrical component which corrodes over time, there is a corresponding reduction in area which causes an increase in resistance. The present invention can detect such degradation prior to the ultimate failure of the device. Electrical components may degrade due to multiple uses which could also lead to eventual fatigue failure. The self heating techniques of the present invention can detect such fatigue. Further, a loose termination such as occurs with a "cold" solder joint can be detected as the termination degrades.

Examples of various failures which may be detected using the present invention include a break in a coil winding, a termination or poor solder joint, a damaged trace on a circuit board, a poor wire wrap termination, a error in soldering, a poor connector damaged to a wire or component due to handling, damage to a wire component due to temperature cycling. Referring back to FIG. 3, such a failure may be detected, for example, at block 158 in which the change in self heating index (.DELTA.SHI) may be compared with a threshold and used to indicate a failure mode. In another aspect of the invention, the diagnostic output is used to compensate for the degradation in the electrical element. For example, the output from a sensor may be compensated as well as the input signal provided to a control element.

Although the present invention has been described with reference to preferred embodiments, workers skilled in the art will recognize that changes may be made in form and detail without departing from the spirit and scope of the invention.

* * * * *
 
Copyright 2006-2008 Patent Looker, LLC