| 1 2 3 4 5 |
| Patent ID | Title | Date Filed |
| 6960520 | Method for forming metal lines in a semiconductor device
| December 30, 2003 |
| 6958289 | Method of forming metal line in semiconductor device
| June 28, 2004 |
| 6953745 | Void-free metal interconnection structure and method of forming the same
| July 15, 2004 |
| 6933190 | Semiconductor device having a capacitor with rare metal electrode
| January 22, 2001 |
| 6930052 | Method for producing an integrated circuit having at least one metalicized surface
| September 3, 2003 |
| 6930036 | Semiconductor device and method of manufacturing the same
| October 28, 2003 |
| 6930001 | Method for manufacturing NAND flash device
| June 24, 2004 |
| 6927161 | Low-k dielectric layer stack including an etch indicator layer for use in the dual damascene technique
| April 22, 2003 |
| 6913993 | Chemical-mechanical polishing method
| November 20, 2001 |
| 6911389 | Self aligned vias in dual damascene interconnect, buried mask approach
| September 18, 2002 |
| 6898851 | Electronic device manufacturing method
| November 21, 2003 |
| 6893958 | Methods for preventing cross-linking between multiple resists and patterning multiple resists
| April 26, 2002 |
| 6890850 | Method of depositing dielectric materials in damascene applications
| July 15, 2002 |
| 6884713 | Method for forming metal line of semiconductor device
| June 30, 2003 |
| 6878620 | Side wall passivation films for damascene cu/low k electronic devices
| November 12, 2002 |
| 6878617 | Method of forming copper wire on semiconductor device
| December 30, 2002 |
| 6878616 | Low-k dielectric material system for IC application
| November 21, 2003 |
| 6878612 | Self-aligned contact process for semiconductor device
| September 16, 2002 |
| 6875685 | Method of forming gas dielectric with support structure
| October 24, 2003 |
| 6867125 | Creating air gap in multi-level metal interconnects using electron beam to remove sacrificial material
| September 26, 2002 |
| 6858525 | Stacked local interconnect structure and method of fabricating same
| April 4, 2003 |
| 6846737 | Plasma induced depletion of fluorine from surfaces of fluorinated low-k dielectric materials
| August 15, 2000 |
| 6844257 | Porous low-k dielectric interconnects with improved adhesion produced by partial burnout of surface porogens
| June 23, 2003 |
| 6844255 | Methods of providing an interlevel dielectric layer intermediate different elevation conductive metal layers in the fabrication of integrated circuitry
| October 9, 2001 |
| 6841478 | Method of forming a multi-layered copper bond pad for an integrated circuit
| March 5, 2003 |
| 6841467 | Method for producing semiconductor device
| April 6, 2001 |
| 6838373 | Lightly doped drain MOS transistor
| October 15, 2002 |
| 6835652 | Method of fabricating patterns with a dual damascene process
| April 8, 2003 |
| 6833318 | Gap-filling process
| November 20, 2002 |
| 6833300 | Method of forming integrated circuit contacts
| January 24, 2003 |
| 6825561 | Structure and method for eliminating time dependent dielectric breakdown failure of low-k material
| June 19, 2003 |
| 6818552 | Method for eliminating reaction between photoresist and OSG
| September 13, 2002 |
| 6815339 | Method for forming copper metal line in semiconductor device
| December 20, 2002 |
| 6815335 | Method for forming a contact in a semiconductor process
| March 31, 2003 |
| 6815334 | Method for forming multi-layer metal line of semiconductor device
| December 30, 2002 |
| 6815333 | Tri-layer masking architecture for patterning dual damascene interconnects
| March 28, 2003 |
| 6812142 | Method and interlevel dielectric structure for improved metal step coverage
| November 14, 2000 |
| 6812130 | Self-aligned dual damascene etch using a polymer
| February 9, 2000 |
| 6812113 | Process for achieving intermetallic and/or intrametallic air isolation in an integrated circuit, and integrated circuit obtained
| October 4, 1999 |
| 6800546 | Film forming method by radiating a plasma on a surface of a low dielectric constant film
| March 12, 2002 |
| 6790766 | Method of fabricating semiconductor device having low dielectric constant insulator film
| March 19, 2003 |
| 6787448 | Methods for forming metal interconnections for semiconductor devices using a buffer layer on a trench sidewall
| August 20, 2003 |
| 6787446 | Fabrication method of semiconductor integrated circuit device
| July 3, 2002 |
| 6784552 | Structure having reduced lateral spacer erosion
| March 31, 2000 |
| 6784094 | Anti-reflective coatings and methods for forming and using same
| December 22, 2003 |
| 6783862 | Toughness, adhesion and smooth metal lines of porous low k dielectric interconnect structures
| November 8, 2002 |
| 6777324 | Multi-layer interconnection structure in semiconductor device and method for fabricating same
| December 9, 2002 |
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