|
| | |
|
Your search returned 1247 patents.
( 438/624 in Current US Classification ) |
|
|
| 1 2 3 4 5 6 7 8 9 10 ... |
| Patent ID | Title | Date Filed |
| 7060619 | Reduction of the shear stress in copper via's in organic interlayer dielectric material
| March 4, 2003 |
| 7060605 | Methods for making dual-damascene dielectric structures
| February 16, 2001 |
| 7060554 | PECVD silicon-rich oxide layer for reduced UV charging
| July 11, 2003 |
| 7056825 | Method for manufacturing a semiconductor device that includes plasma treating an insulating film with a mixture of helium and argon gases
| May 28, 2004 |
| 7056823 | Backend metallization method and device obtained therefrom
| January 11, 2005 |
| 7052971 | Method for manufacturing semiconductor device
| July 12, 2002 |
| 7049211 | In-situ-etch-assisted HDP deposition using SiF.sub.4
| March 25, 2005 |
| 7049153 | Polymer-based ferroelectric memory
| April 23, 2003 |
| 7045453 | Very low effective dielectric constant interconnect structures and methods for fabricating the same
| April 12, 2005 |
| 7045372 | Apparatus and method for forming a battery in an integrated circuit
| August 2, 2003 |
| 7041586 | Semiconductor device having a multilayer interconnection structure
| March 26, 2002 |
| 7041574 | Composite intermetal dielectric structure including low-k dielectric material
| July 19, 2004 |
| 7041534 | Semiconductor chip package and method for making the same
| August 26, 2004 |
| 7037851 | Methods for selective integration of airgaps and devices made by such methods
| September 30, 2004 |
| 7037823 | Method to reduce silanol and improve barrier properties in low k dielectric ic interconnects
| July 27, 2004 |
| 7037822 | Method of forming metal line in semiconductor device
| December 10, 2003 |
| 7034400 | Dual damascene interconnect structure using low stress fluorosilicate insulator with copper conductors
| September 10, 2003 |
| 7034380 | Low-dielectric constant structure with a multilayer stack of thin films with pores
| September 12, 2003 |
| 7033908 | Methods of forming integrated circuit devices including insulation layers
| February 10, 2004 |
| 7030005 | Method of manufacturing semiconductor device
| December 30, 2004 |
| 7026234 | Parasitic capacitance-preventing dummy solder bump structure and method of making the same
| June 8, 2004 |
| 7023093 | Very low effective dielectric constant interconnect Structures and methods for fabricating the same
| October 24, 2002 |
| 7023091 | Semiconductor integrated circuit device
| June 20, 2003 |
| 7022602 | Nitrogen-enriched low-k barrier layer for a copper metallization layer
| November 19, 2003 |
| 7015133 | Dual damascene structure formed of low-k dielectric materials
| April 14, 2004 |
| 1 2 3 4 5 6 7 8 9 10 ... |
|
|
|
|
|
|
|
|
|
|
|