| 1 2 3 |
| Patent ID | Title | Date Filed |
| 6734563 | Post passivation interconnection schemes on top of the IC chips
| October 22, 2002 |
| 6734547 | Semiconductor wiring structure having divided power lines and ground lines on the same layer
| August 6, 2002 |
| 6730946 | Semiconductor device
| January 25, 2002 |
| 6727597 | Integrated circuit device having C4 and wire bond connections
| December 27, 2001 |
| 6717270 | Integrated circuit die I/O cells
| April 9, 2003 |
| 6687880 | Integrated circuit having a reduced spacing between a bus and adjacent circuitry
| September 16, 2002 |
| 6683476 | Contact ring architecture
| May 8, 2002 |
| 6683336 | SEMICONDUCTOR INTEGRATED CIRCUIT, SUPPLY METHOD FOR SUPPLYING MULTIPLE SUPPLY VOLTAGES IN SEMICONDUCTOR INTEGRATED CIRCUIT, AND RECORD MEDIUM FOR STORING PROGRAM OF SUPPLY METHOD FOR SUPPLYING MULTIPLE SUPPLY VOLTAGES IN SEMICONDUCTOR INTEGRATED CIRCUIT
| July 3, 2000 |
| 6677781 | Semiconductor integrated circuit device
| June 14, 2002 |
| 6675367 | Semiconductor integrated circuits and method for designing the same
| June 13, 2000 |
| 6661100 | Low impedance power distribution structure for a semiconductor chip package
| July 30, 2002 |
| 6657910 | Semiconductor device having internal power terminals including a positive power terminal and a negative power terminal
| October 7, 2002 |
| 6657310 | Top layers of metal for high performance IC's
| October 9, 2001 |
| 6657307 | Semiconductor integrated circuit having functional macro with improved power line connection structure
| May 25, 2001 |
| 6657291 | Combined resistor-capacitor elements for decoupling in electronic packages
| December 19, 1997 |
| 6657285 | Semiconductor anti-interference band for integrated circuit
| July 8, 2002 |
| 6653857 | Increasing implicit decoupling capacitance using asymmetric shieldings
| October 31, 2001 |
| 6653726 | Power redistribution bus for a wire bonded integrated circuit
| September 7, 2001 |
| 6653563 | Alternate bump metallurgy bars for power and ground routing
| March 30, 2001 |
| 6649509 | Post passivation metal scheme for high-performance integrated circuit devices
| October 24, 2001 |
| 6645842 | Semiconductor integrated circuit device, semiconductor integrated circuit wiring method, and cell arranging method
| July 18, 2002 |
| 6638793 | Methodology to pack standard staggered bond input-output buffer into linear input-output buffer
| March 4, 2002 |
| 6635515 | Method of manufacturing a semiconductor device having signal line above main ground or main VDD line
| April 11, 2002 |
| 6628138 | Increasing decoupling capacitance using preferential shields
| November 30, 2001 |
| 6624515 | Microelectronic die including low RC under-layer interconnects
| March 11, 2002 |
| 6620728 | Top layers of metal for high performance IC's
| January 29, 2002 |
| 6609242 | Automated creation of power distribution grids for tiled cell arrays in integrated circuit designs
| July 20, 2001 |
| 6605528 | Post passivation metal scheme for high-performance integrated circuit devices
| October 24, 2001 |
| 6598206 | Method and system of modifying integrated circuit power rails
| May 10, 2001 |
| 6593654 | Semiconductor device and method for manufacturing same
| March 19, 1999 |
| 6586828 | Integrated circuit bus grid having wires with pre-selected variable widths
| October 17, 2001 |
| 6581201 | Method for power routing and distribution in an integrated circuit with multiple interconnect layers
| October 2, 2001 |
| 6560762 | Semiconductor integrated circuit and wiring method
| January 17, 2001 |
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