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Your search returned 693 patents.
( 257/E23.079 in Current US Classification ) |
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| Patent ID | Title | Date Filed |
| 6900544 | Integrated circuit package and printed circuit board arrangement
| September 9, 2003 |
| 6897555 | Integrated circuit package and method for a PBGA package having a multiplicity of staggered power ring segments for power connection to integrated circuit die
| July 23, 2003 |
| 6897091 | Semiconductor device and manufacturing method thereof
| May 16, 2002 |
| 6894230 | Printed circuit board employing lossy power distribution network to reduce power plane resonances
| February 26, 2004 |
| 6891247 | Semiconductor device including semiconductor bare chip mounted by flip-chip bonding, and board member with thin-film structure capacitor for semiconductor bare chip mounted by flip-chip bonding
| June 24, 2002 |
| 6888235 | Power delivery system for integrated circuits utilizing discrete capacitors
| September 25, 2002 |
| 6885563 | Power delivery and other systems for integrated circuits
| September 26, 2002 |
| 6884658 | Die stacking scheme
| November 16, 2001 |
| 6882039 | Semiconductor device
| August 3, 2004 |
| 6879039 | Ball grid array package substrates and method of making the same
| December 18, 2001 |
| 6876554 | Printing wiring board and method of producing the same and capacitor to be contained in printed wiring board
| April 25, 2001 |
| 6876227 | Simplifying the layout of printed circuit boards
| March 29, 2002 |
| 6876084 | Chip package structure
| October 25, 2002 |
| 6873513 | Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package
| September 16, 2003 |
| 6873038 | Capacitor and semiconductor device and method for fabricating the semiconductor device
| July 30, 2003 |
| 6873036 | Die stacking scheme
| August 28, 2002 |
| 6873035 | Semiconductor device having capacitors for reducing power source noise
| May 2, 2001 |
| 6870273 | High speed I/O pad and pad/cell interconnection for flip chips
| April 29, 2003 |
| 6870257 | Power delivery through a flex tape in decoupled I/O-power hybrid substrate
| June 4, 2003 |
| 6870252 | Chip packaging and connection for reduced EMI
| June 18, 2003 |
| 6870251 | High-power LGA socket
| May 29, 2002 |
| 6867502 | Semiconductor device
| February 21, 2003 |
| 6864587 | Semiconductor device
| March 18, 2003 |
| 6864122 | Multi-chip module having content addressable memory
| December 17, 2002 |
| 6861740 | Flip-chip die and flip-chip package substrate
| April 26, 2004 |
| 6858945 | Multi-concentric pad arrangements for integrated circuit pads
| January 31, 2003 |
| 6858892 | Semiconductor device
| August 11, 2003 |
| 6853559 | Thermal management of power delivery systems for integrated circuits
| September 26, 2002 |
| 6853061 | Dual power supply method and apparatus
| October 18, 2002 |
| 6852553 | Semiconductor device fabrication method and semiconductor device fabrication apparatus
| May 3, 2002 |
| 6847120 | Flip chip semiconductor device having signal pads arranged outside of power supply pads
| December 18, 2001 |
| 6847108 | Semiconductor integrated circuit
| March 30, 2004 |
| 6844630 | Semiconductor integrated circuit device and wiring arranging method thereof
| February 25, 2002 |
| 6844209 | Semiconductor device having a matrix array of contacts and a fabrication process thereof
| December 10, 2002 |
| 6842347 | Data processing system and associated control chip and printed circuit board
| April 19, 2002 |
| 6841886 | Layout structure for a flip chip semiconductor integrated circuit
| August 15, 2002 |
| 6841864 | Semiconductor integrated circuit device, mounting board, and device and board assembly
| July 3, 2002 |
| 6841852 | Integrated circuit package for semiconductor devices with improved electric resistance and inductance
| July 2, 2002 |
| 6838773 | Semiconductor chip and semiconductor device using the semiconductor chip
| December 19, 2002 |
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