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Your search returned 817 patents.
( 257/E23.02 in Current US Classification ) |
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| Patent ID | Title | Date Filed |
| 6963140 | Transistor having multiple gate pads
| March 17, 2003 |
| 6963138 | Dielectric stack
| February 3, 2003 |
| 6960836 | Reinforced bond pad
| September 30, 2003 |
| 6960831 | Semiconductor device having a composite layer in addition to a barrier layer between copper wiring and aluminum bond pad
| September 25, 2003 |
| 6956294 | Apparatus for routing die interconnections using intermediate connection elements secured to the die face
| March 16, 2000 |
| 6955936 | Methods and devices related to electrode pads for p-type Group III nitride compound semiconductors
| September 26, 2003 |
| 6953997 | Semiconductor device with improved bonding pad connection and placement
| June 4, 2004 |
| 6953995 | Hermetic chip in wafer form
| July 22, 2003 |
| 6949407 | Castellation wafer level packaging of integrated circuit chips
| January 7, 2005 |
| 6940179 | Innovative solder ball pad structure to ease design rule, methods of fabricating same and substrates, electronic device assemblies and systems employing same
| March 12, 2004 |
| 6940157 | High frequency semiconductor module, high frequency semiconductor device and manufacturing method for the same
| August 2, 2004 |
| 6940148 | Semiconductor device capable of adjusting input resistance without changing input terminal capacitance
| February 13, 2004 |
| 6936500 | Method for the lateral contacting of a semiconductor chip
| July 29, 2004 |
| 6933616 | Multi-chip module packaging device using flip-chip bonding technology
| October 29, 2002 |
| 6933614 | Integrated circuit die having a copper contact and method therefor
| September 15, 2003 |
| 6933600 | Substrate for semiconductor package
| May 20, 2002 |
| 6930380 | Semiconductor device
| June 4, 2004 |
| 6930379 | Power gridding scheme
| October 7, 2003 |
| 6930032 | Under bump metallurgy structural design for high reliability bumped packages
| May 14, 2002 |
| 6927493 | Sealing and protecting integrated circuit bonding pads
| October 3, 2003 |
| 6927457 | Circuit structure for connecting bonding pad and ESD protection circuit
| May 20, 2004 |
| 6927156 | Apparatus and method extending flip-chip pad structures for wirebonding on low-k dielectric silicon
| June 18, 2003 |
| 6924554 | Wirebond structure and method to connect to a microelectronic die
| June 5, 2003 |
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