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Your search returned 204 patents.
( 257/785 in Current US Classification ) |
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| 1 2 3 |
| Patent ID | Title | Date Filed |
| 5962924 | Semi-conductor die interconnect
| August 17, 1998 |
| 5949137 | Stiffener ring and heat spreader for use with flip chip packaging assemblies
| September 26, 1997 |
| 5933327 | Wire bond attachment of a integrated circuit package to a heat sink
| April 3, 1998 |
| 5903059 | Microconnectors
| November 21, 1995 |
| 5892275 | High performance power and ground edge connect IC package
| September 4, 1997 |
| 5877555 | Direct contact die attach
| December 20, 1996 |
| 5874750 | Pressure-contact type semiconductor device
| November 6, 1996 |
| 5861666 | Stacked chip assembly
| August 29, 1996 |
| 5822190 | Card type memory device and a method for manufacturing the same
| June 10, 1997 |
| 5783860 | Heat sink bonded to a die paddle having at least one aperture
| February 4, 1997 |
| 5770891 | Socket for semi-permanently connecting a solder ball grid array device using a dendrite interposer
| September 18, 1996 |
| 5760467 | Semiconductor device lead frame having sunk die pad portions
| September 15, 1992 |
| 5739556 | Pressure contact housing for semiconductor components
| February 1, 1996 |
| 5734176 | Impedance controlled test fixture for multi-lead surface mounted integrated circuits
| February 26, 1996 |
| 5705853 | Power semiconductor module
| August 19, 1996 |
| 5677576 | Chip sized semiconductor device
| March 20, 1996 |
| 5668407 | Integrated circuit carrier having lead-socket array with various inner dimensions
| July 1, 1996 |
| 1 2 3 |
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