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Your search returned 1415 patents.
( 257/784 in Current US Classification ) |
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| Patent ID | Title | Date Filed |
| 7183588 | Light emission device
| January 8, 2004 |
| 7180170 | Lead-free integrated circuit package structure
| January 24, 2005 |
| 7180162 | Arrangement for reducing stress in substrate-based chip packages
| May 21, 2004 |
| 7180161 | Lead frame for improving molding reliability and semiconductor package with the lead frame
| January 19, 2005 |
| 7176580 | Structures and methods for wire bonding over active, brittle and low K dielectric areas of an IC chip
| October 25, 2004 |
| 7176570 | Method for forming bump, semiconductor element having bumps and method of manufacturing the same, semiconductor device and method of manufacturing the same, circuit board, and electronic equipment
| July 29, 2005 |
| 7173498 | Reducing the coupling between LC-oscillator-based phase-locked loops in flip-chip ASICs
| September 28, 2004 |
| 7170187 | Low stress conductive polymer bump
| August 31, 2004 |
| 7166919 | Leadless type semiconductor package, and production process for manufacturing such leadless type semiconductor package
| August 13, 2004 |
| 7164209 | Methods of positioning and/or orienting nanostructures
| December 1, 2004 |
| 7164208 | Semiconductor device and method for manufacturing the same
| January 19, 2005 |
| 7164205 | Semiconductor carrier film, and semiconductor device and liquid crystal module using the same
| June 29, 2004 |
| 7164196 | Semiconductor device
| June 7, 2004 |
| 7161239 | Ball grid array package enhanced with a thermal and electrical connector
| October 31, 2002 |
| 7157797 | Semiconductor device with suppressed copper migration
| June 6, 2005 |
| 7154171 | Stacking structure for semiconductor devices using a folded over flexible substrate and method therefor
| February 22, 2002 |
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