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Your search returned 869 patents.
( 257/783 in Current US Classification ) |
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| Patent ID | Title | Date Filed |
| 7084517 | Semiconductor device connecting structure, liquid crystal display unit based on the same connecting structure, and electronic apparatus using the same display unit
| September 30, 2004 |
| 7084516 | Surface protection film
| July 15, 2002 |
| 7084492 | Underfill and mold compounds including siloxane-based aromatic diamines
| June 30, 2003 |
| 7084351 | Electrical device allowing for increased device densities
| September 9, 2002 |
| 7084011 | Forming a chip package having a no-flow underfill
| December 30, 2003 |
| 7081675 | Multilayered anisotropic conductive adhesive for fine pitch
| August 16, 2004 |
| 7078820 | Semiconductor apparatus and process of production thereof
| July 25, 2001 |
| 7075177 | Semiconductor chip package
| July 25, 2001 |
| 7075173 | Interposer including adhesive tape
| May 6, 2005 |
| 7071577 | Semiconductor device and resin binder for assembling semiconductor device
| October 15, 2003 |
| 7071572 | Pre-back-grind and underfill layer for bumped wafers and dies
| August 3, 2004 |
| 7071568 | Stacked-die extension support structure and method thereof
| November 17, 2004 |
| 7071488 | Active matrix display device and thin film transistor display device
| January 28, 2004 |
| 7064446 | Under bump metallization layer to enable use of high tin content solder bumps
| March 29, 2004 |
| 7063756 | Enhanced design and process for a conductive adhesive
| February 4, 2003 |
| 7061121 | Stacked microelectronic assemblies with central contacts
| November 12, 2004 |
| 7061119 | Tape attachment chip-on-board assemblies
| April 5, 2000 |
| 7061107 | Semiconductor device and manufacturing method of the same
| June 18, 2004 |
| 7057294 | Semiconductor device
| July 12, 2002 |
| 7057265 | Semiconductor device and process for fabrication thereof
| May 2, 2003 |
| 7053494 | Semiconductor device and production method therefor
| May 6, 2004 |
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