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Your search returned 539 patents.
( 257/781 in Current US Classification ) |
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| Patent ID | Title | Date Filed |
| 6995474 | Electrical conducting structure and liquid crystal display device comprising the same
| September 17, 2004 |
| 6992001 | Screen print under-bump metalization (UBM) to produce low cost flip chip substrate
| May 8, 2003 |
| 6984895 | Bonding pad structure of a semiconductor device
| April 19, 2002 |
| 6984792 | Dielectric interposer for chip to substrate soldering
| May 1, 2003 |
| 6982494 | Semiconductor device with signal line having decreased characteristic impedance
| August 1, 2003 |
| 6979905 | Semiconductor device
| January 23, 2004 |
| 6969915 | Semiconductor device, manufacturing method and apparatus for the same
| January 14, 2002 |
| 6969909 | Flip chip FET device
| December 20, 2002 |
| 6967411 | Stackable layers containing ball grid array packages
| February 7, 2003 |
| 6960831 | Semiconductor device having a composite layer in addition to a barrier layer between copper wiring and aluminum bond pad
| September 25, 2003 |
| 6960830 | Semiconductor integrated circuit device with dummy bumps
| October 30, 2003 |
| 6958546 | Method for dual-layer polyimide processing on bumping technology
| May 13, 2003 |
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