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| Patent ID | Title | Date Filed |
| 7221055 | System and method for die attach using a backside heat spreader
| May 23, 2005 |
| 7221048 | Multilayer circuit carrier, panel, electronic device, and method for producing a multilayer circuit carrier
| February 1, 2005 |
| 7221045 | Flat chip semiconductor device and manufacturing method thereof
| May 20, 2005 |
| 7221044 | Heterogeneous integrated high voltage DC/AC light emitter
| January 21, 2005 |
| 7221041 | Multi-chips module package and manufacturing method thereof
| July 28, 2004 |
| 7219825 | SnAgAu solder bumps, method of manufacturing the same, and method of bonding light emitting device using the same
| September 27, 2004 |
| 7218007 | Underfill material to reduce ball limiting metallurgy delamination and cracking potential in semiconductor devices
| September 28, 2004 |
| 7218005 | Compact semiconductor device capable of mounting a plurality of semiconductor chips with high density and method of manufacturing the same
| October 12, 2004 |
| 7218001 | Reduced footprint packaged microelectronic components and methods for manufacturing such microelectronic components
| April 5, 2004 |
| 7215030 | Lead-free semiconductor package
| June 27, 2005 |
| 7215026 | Semiconductor module and method of forming a semiconductor module
| October 11, 2005 |
| 7215017 | Wafer level package, wafer level packaging procedure for making wafer level package
| April 28, 2004 |
| 7215016 | Multi-chips stacked package
| December 30, 2003 |
| 7215015 | Imaging system
| July 26, 2004 |
| 7214561 | Packaging assembly and method of assembling the same
| July 30, 2004 |
| 7211893 | Integrating chip scale packaging metallization into integrated circuit die structures
| November 3, 2004 |
| 7208842 | Semiconductor chip, mounting structure thereof, and methods for forming a semiconductor chip and printed circuit board for the mounting structure thereof
| August 5, 2004 |
| 7208833 | Electronic circuit device having circuit board electrically connected to semiconductor element via metallic plate
| March 3, 2005 |
| 7208830 | Interconnect shunt used for current distribution and reliability redundancy
| June 30, 2004 |
| 7208828 | Semiconductor package with wire bonded stacked dice and multi-layer metal bumps
| April 8, 2005 |
| 7208825 | Stacked semiconductor packages
| May 9, 2005 |
| 7208820 | Substrate having a plurality of I/O routing arrangements for a microelectronic device
| December 29, 2004 |
| 7208758 | Dynamic integrated circuit clusters, modules including same and methods of fabricating
| September 16, 2003 |
| 7208402 | Method and apparatus for improved power routing
| June 3, 2005 |
| 7205672 | Flip chip mounted to thermal sensing element through the back side of the chip
| December 17, 2003 |
| 7205671 | Semiconductor device
| September 16, 2003 |
| 7205670 | Semiconductor device and manufacturing method therefor
| August 28, 2003 |
| 7205660 | Wafer level chip scale package having a gap and method for manufacturing the same
| July 22, 2005 |
| 7205646 | Electronic device and chip package
| April 22, 2003 |
| 7205645 | Wiring board, semiconductor device, and method of manufacturing wiring board
| February 21, 2001 |
| 7205177 | Methods of bonding two semiconductor devices
| June 30, 2005 |
| 7202571 | Electronic module with form in-place pedestal
| August 16, 2004 |
| 7202569 | Semiconductor device and manufacturing method of the same
| November 12, 2004 |
| 7202556 | Semiconductor package having substrate with multi-layer metal bumps
| December 20, 2001 |
| 7202420 | Methods to prevent mechanical flexure related BGA failure
| December 16, 2003 |
| 7199479 | Chip package structure and process for fabricating the same
| March 31, 2005 |
| 7199464 | Semiconductor device structures including protective layers formed from healable materials
| February 8, 2005 |
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