| 1 2 3 4 5 6 7 8 9 10 ... |
| Patent ID | Title | Date Filed |
| 7242099 | Chip package with multiple chips connected by bumps
| October 27, 2003 |
| 7242095 | Semiconductor device having a dummy pattern
| February 23, 2005 |
| 7242094 | Semiconductor device having capacitor formed in multilayer wiring structure
| July 25, 2003 |
| 7242025 | Radiation emitting semiconductor component having a nitride compound semiconductor body and a contact metallization layer on its surface
| January 31, 2003 |
| 7241683 | Stabilized photoresist structure for etching process
| March 8, 2005 |
| 7241682 | Method of forming a dual damascene structure
| February 27, 2004 |
| 7239337 | Combined semiconductor apparatus with thin semiconductor films
| November 13, 2003 |
| 7239019 | Selectively converted inter-layer dielectric
| June 28, 2005 |
| 7239018 | Composition for forming a porous film prepared by hydrolysis and condensation of an alkoxysilane using a trialkylmethylammonium hydroxide catalyst
| March 9, 2004 |
| 7239005 | Semiconductor device with bypass capacitor
| July 19, 2004 |
| 7239002 | Integrated circuit device
| January 21, 2005 |
| 7238980 | Semiconductor device having plural electroconductive plugs
| August 18, 2004 |
| 7236385 | Memory architecture
| June 30, 2004 |
| 7235882 | Semiconductor device having a wiring layer of damascene structure and method for manufacturing the same
| May 5, 2005 |
| 7235881 | Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument
| December 31, 2002 |
| 7235858 | Edge intensive antifuse and method for making the same
| June 30, 2004 |
| 7233070 | Semiconductor device having no cracks in one or more layers underlying a metal line layer and method of manufacturing the same
| July 8, 2004 |
| 7233052 | Semiconductor device including fine dummy patterns
| March 18, 2005 |
| 7232746 | Method for forming dual damascene interconnection in semiconductor device
| December 30, 2004 |
| 7230338 | Semiconductor device that improves electrical connection reliability
| June 2, 2005 |
| 7230337 | Semiconductor device including ladder-shaped siloxane hydride and method for manufacturing same
| January 21, 2004 |
| 7230336 | Dual damascene copper interconnect to a damascene tungsten wiring level
| January 7, 2003 |
| 7227266 | Interconnect structure to reduce stress induced voiding effect
| November 9, 2004 |
| 7227255 | Semiconductor device and method of producing the same
| April 5, 2005 |
| 7227244 | Integrated low k dielectrics and etch stops
| August 24, 2004 |
| 7227231 | Semiconductor integrated circuit device
| February 25, 2005 |
| 7227214 | Semiconductor device and method of manufacturing the same
| April 2, 2002 |
| 7226857 | Front-end processing of nickel plated bond pads
| July 30, 2004 |
| 7224068 | Stable metal structure with tungsten plug
| August 17, 2004 |
| 7224064 | Semiconductor device having conductive interconnections and porous and nonporous insulating portions
| January 24, 2005 |
| 7224063 | Dual-damascene metallization interconnection
| June 1, 2001 |
| 7224060 | Integrated circuit with protective moat
| January 30, 2004 |
| 7223630 | Low stress semiconductor device coating and method of forming thereof
| December 3, 2004 |
| 7221050 | Substrate having a functionally gradient coefficient of thermal expansion
| September 2, 2004 |
| 7221034 | Semiconductor structure including vias
| February 27, 2004 |
| 7217979 | Semiconductor apparatus including a radiator for diffusing the heat generated therein
| June 23, 2004 |
| 7217963 | Semiconductor integrated circuit device
| December 30, 2005 |
| 7217370 | Wiring board and process for producing the same
| March 8, 2005 |
| 7215029 | Multilayer interconnection structure of a semiconductor
| January 5, 1999 |
| 7215028 | Semiconductor device and method for fabricating the same
| September 22, 2004 |
| 7215000 | Selectively encased surface metal structures in a semiconductor device
| August 23, 2004 |
| 7211897 | Semiconductor device and method for fabricating the same
| October 29, 2003 |
| 7208843 | Routing design to minimize electromigration damage to solder bumps
| February 1, 2005 |
| 7208837 | Semiconductor chip capable of implementing wire bonding over active circuits
| April 22, 2005 |
| 7208836 | Integrated circuitry and a semiconductor processing method of forming a series of conductive lines
| August 26, 2003 |
| 7208831 | Semiconductor device having multilayer wiring structure and method, wherein connecting portion and wiring layer are formed of same layer
| January 8, 2004 |
| 7205668 | Multi-layer printed circuit board wiring layout
| November 22, 2005 |
| 7205667 | Semiconductor device having copper wiring
| November 23, 2004 |
| 7205666 | Interconnections having double capping layer and method for forming the same
| March 3, 2006 |
| 7205665 | Porous silicon undercut etching deterrent masks and related methods
| October 3, 2005 |
| 7205664 | Semiconductor device and method for manufacturing the same
| July 12, 2004 |
| 7205650 | Composite devices of laminate type and processes
| February 12, 2002 |
| 7205649 | Ball grid array copper balancing
| June 30, 2003 |
| 7205637 | Semiconductor device with a multilevel interconnection connected to a guard ring and alignment mark
| May 22, 2006 |
| 7205636 | Semiconductor device with a multilevel interconnection connected to a guard ring
| May 22, 2006 |
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