| 1 |
| Patent ID | Title | Date Filed |
| 5977616 | Interdigitated leads-over-chip lead frame, device, and method for supporting an integrated circuit die
| August 26, 1998 |
| 5955783 | High frequency signal processing chip having signal pins distributed to minimize signal interference
| June 18, 1997 |
| 5923092 | Wiring between semiconductor integrated circuit chip electrode pads and a surrounding lead frame
| December 24, 1996 |
| 5903050 | Semiconductor package having capacitive extension spokes and method for making the same
| April 30, 1998 |
| 5869884 | Semiconductor device having lead terminal on only one side of a package
| June 26, 1997 |
| 5828126 | Chip on board package with top and bottom terminals
| June 6, 1994 |
| 5828116 | Semiconductor device with bonded wires
| January 21, 1997 |
| 5828000 | Semiconductor device with heat radiating plate and positioning dummy lead and lead frame therefor
| April 17, 1997 |
| 5818105 | Semiconductor device with plastic material covering a semiconductor chip mounted on a substrate of the device
| July 21, 1995 |
| 5790383 | Printed circuit board
| February 19, 1997 |
| 5777382 | Plastic packaging for a surface mounted integrated circuit
| December 19, 1996 |
| 5744858 | Semiconductor packaging technique yielding increased inner lead count for a given die-receiving area
| September 26, 1996 |
| 5736792 | Method of protecting bond wires during molding and handling
| August 28, 1996 |
| 5723902 | Surface mounting type electronic component
| July 30, 1996 |
| 5701234 | Surface mount component for selectively configuring a printed circuit board and method for using the same
| December 6, 1995 |
| 5684332 | Method of packaging a semiconductor device with minimum bonding pad pitch and packaged device therefrom
| December 20, 1995 |
| 5525836 | Multilayer metal leadframe
| February 21, 1995 |
| 5512782 | Semiconductor device for DC/AC converter
| October 4, 1994 |
| 5466968 | Leadframe for making semiconductor devices
| November 1, 1994 |
| 5428246 | Highly integrated electronic component with heat-conductive plate
| July 6, 1993 |
| 5394298 | Semiconductor devices
| February 2, 1994 |
| 5365655 | Method of making an electronic module for a memory card and an electronic module thus obtained
| February 13, 1992 |
| 5329423 | Compressive bump-and-socket interconnection scheme for integrated circuits
| April 13, 1993 |
| 5308797 | Leads for semiconductor chip assembly and method
| November 24, 1992 |
| 5304844 | Semiconductor device and method of producing the same
| May 28, 1992 |
| 5250844 | Multiple power/ground planes for tab
| October 9, 1992 |
| 5105261 | Semiconductor device package having particular lead structure for mounting multiple circuit boards
| September 9, 1991 |
| 5091822 | Radial type of parallel system bus structure with printed, twisted conductor lines
| June 11, 1990 |
| 5088008 | Circuit board for mounting electronic components
| September 28, 1990 |
| 5072281 | Interconnection lead having individual spiral lead design
| January 29, 1991 |
| 5072279 | Electrical interconnection having angular lead design
| October 29, 1990 |
| 5034800 | Hollow plastic package for semiconductor devices
| June 15, 1989 |
| 5032895 | Semiconductor device and method of producing the same
| April 18, 1990 |
| 5018003 | Lead frame and semiconductor device
| August 21, 1990 |
| 4974057 | Semiconductor device package with circuit board and resin
| January 9, 1989 |
| 4951122 | Resin-encapsulated semiconductor device
| May 27, 1988 |
| 4949160 | Semiconductor device
| December 16, 1988 |
| 4801996 | Gigahertz rate integrated circuit package incorporating semiconductive MIS power-line substrate
| October 14, 1987 |
| 4706105 | Semiconductor device and method of producing the same
| June 13, 1986 |
| 4661837 | Resin-sealed radiation shield for a semiconductor device
| December 12, 1985 |
| 4660069 | Device with captivate chip capacitor devices and method of making the same
| May 14, 1986 |
| 4392152 | Semiconductor device
| October 31, 1980 |
| 4044374 | Semiconductor device header suitable for vacuum tube applications
| January 19, 1976 |
| 4003073 | Integrated circuit device employing metal frame means with preformed conductor means
| October 10, 1972 |
| 1 |