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Your search returned 1002 patents.
( 257/691 in Current US Classification ) |
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| Patent ID | Title | Date Filed |
| 7132743 | Integrated circuit package substrate having a thin film capacitor structure
| December 23, 2003 |
| 7132740 | Semiconductor package with conductor impedance selected during assembly
| April 10, 2003 |
| 7129588 | Portable telephone
| June 17, 2005 |
| 7129574 | Multi-power ring chip scale package for system level integration
| July 2, 2004 |
| 7129571 | Semiconductor chip package having decoupling capacitor and manufacturing method thereof
| October 28, 2004 |
| 7126230 | Semiconductor electronic device and method of manufacturing thereof
| June 9, 2004 |
| 7126218 | Embedded heat spreader ball grid array
| August 7, 2001 |
| 7122888 | Semiconductor device, electrical inspection method thereof, and electronic apparatus including the semiconductor device
| March 29, 2005 |
| 7120031 | Data processing system comprising ceramic/organic hybrid substrate with embedded capacitors
| July 2, 2004 |
| 7119448 | Main power inductance based on bond wires for a switching power converter
| October 18, 2004 |
| 7119437 | Electronic substrate, power module and motor driver
| December 17, 2003 |
| 7119420 | Chip packaging structure adapted to reduce electromagnetic interference
| June 24, 2005 |
| 7115984 | Semiconductor devices including peripherally located bond pads, intermediates thereof, assemblies, and packages including the semiconductor devices, and support elements for the semiconductor devices
| December 15, 2003 |
| 7112880 | Depopulation of a ball grid array to allow via placement
| November 17, 2004 |
| 7105858 | Electronic assembly/system with reduced cost, mass, and volume and increased efficiency and power density
| July 23, 2003 |
| 7098533 | Printed circuit board with a heat dissipation element and package comprising the printed circuit board
| September 7, 2004 |
| 7098528 | Embedded redistribution interposer for footprint compatible chip package conversion
| December 22, 2003 |
| 7098527 | Integrated circuit package electrical enhancement with improved lead frame design
| August 4, 2003 |
| 7095117 | Semiconductor device and an electronic device
| September 14, 2004 |
| 7095107 | Ball assignment schemes for integrated circuit packages
| December 7, 2004 |
| 7091598 | Electronic circuit device
| January 19, 2001 |
| 7091588 | Semiconductor device including primary and secondary side circuits on first and second substrates with capacitive insulation
| December 30, 2004 |
| 7087992 | Multichip wafer level packages and computing systems incorporating same
| November 30, 2004 |
| 7084500 | Semiconductor circuit with multiple contact sizes
| October 29, 2003 |
| 7081667 | Power LED package
| September 24, 2004 |
| 7081660 | Hermetic package with internal ground pads
| June 19, 2001 |
| 7078824 | Semiconductor device having a switch circuit
| August 16, 2005 |
| 7078788 | Microelectronic substrates with integrated devices
| October 13, 2004 |
| 7075179 | System for implementing a configurable integrated circuit
| December 17, 2004 |
| 7071569 | Electrical package capable of increasing the density of bonding pads and fine circuit lines inside a interconnection
| June 9, 2004 |
| 7068521 | Semiconductor device
| August 2, 2005 |
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